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Square Bar Crack Detection Equipment SC-MC-BI is used for targeted removal of cracks and stress, avoiding batch breakage. It analyzes the distribution patterns of crack and stress locations, optimizes the silicon bar transfer process, and reduces breakage rate. It can be combined with square bar dimension inspection for integrated square bar testing.
Device image 1
Device image 2
Device image 3Inspect finished square bars for cracks and stress to ensure outgoing quality.
Re-inspect incoming square bars to eliminate cracks and stress issues, preventing breakage during slicing.
Accurately locate defects to avoid slicing waste.
Achieve integrated square bar testing with data sharing.
Interface with MES for production traceability.
Adjust detection parameters according to customer requirements.
Provides stress distribution in square bars, offering an efficient and reliable means for anomaly analysis.
Equipped with a high-sensitivity infrared camera, compatible with both N-type and P-type bars, and adaptable to a wide range of resistivity square bars.
Model
SC-MC-BI
Infrared Camera
1k line scan
Detectable Types
Crack, diameter, length, stress, twin crystal, dislocation detection, etc.
Crack Detection
Positioning accuracy ±1mm, cracks with length ≥1mm can be detected
Marking Specification
Mark according to stress (compatible with traditional marking rules)
Test Platform
Windows
Power Consumption
800W
Input Voltage
AC 220V
Computer
DELL
Monitor
2K monitor
Data Storage
100,000 images
Inspection Object
Square bar
Weight
300kg
Operating Temperature
-30℃~80℃
Relative Humidity
≤85%RH
Accurate detection of cracks and stress in square bars prevents wafer breakage, optimizes processes, and reduces production costs. It can be integrated with dimension inspection, uploads data to MES, supporting smart manufacturing.
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